| Main specification | |
|---|---|
| Brand | Panasonic |
| Model | MSF |
| Type 1 | SMT Equipment |
| Type 2 | Mounting Equipment |
| Type 3 | Pick and Place Machine |
| Size | 1720x2660x1450mm |
| Weight | 2,800kg |
| Voltage | 3phase AC200V ±10V 50HZ (9KVA) |
| Rated power | |
| Gas source | 0.5MPa (Traffic:300Nl/min) |
| Operating System | |
| Other |
| PCBBoard Application | |
|---|---|
| Dimensions(XL) | Max.510* 460; Min.50* 50 |
| Paste Range | Max.510* 454; Min.50* 44 |
| Thickness | 0.5~4.0mm |
| Widget | |
|---|---|
| Paste Time | Chip 0.094sec/pieceQFP 0.26sec/piece |
| SIZE | Max:55* 55, Max(Length):150,Max(Height):25 Min(Lead Pitch):0.3 |
| Paste Angle | 0º~359º |
| Parts Feeder | |
|---|---|
| Cassette | Z No. 1~192 (Adopt:double Cassette) |
| Tray | Z No. 201~248 |
| Storage Procedures Number | |
|---|---|
| NC Program | Max. 200 , 5000steps/product |
| Parts Library | Max. 1000 library |
| Mark Library | Max. 500 library |
| Supply Library | Max. 500 library |
| Nozzle Library | Max. 100 library |
| Visual Recognition Unit | |
|---|---|
| 2D Small | chip 0603~3.3* 3.3 |
| 2D Large | QFP 3.3* 3.3~55* 55BGA 3.3* 3.3~55* 55Cont. L150* W25* H25 |
| 3D Small | QFP 3.3* 3.3~20* 20BGA 3.3* 3.3~20* 20 |
| 3D Small | QFP 10* 10~55* 55BGA 10* 10~55* 55 |
Vorige:FUJI XP141 SMT machine
Volgende:Panasonic SPF Solder Paste Printer
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