Summary procedure changes,If SelectC4Composition(There's a reprinter),Exchange tools through clients,Change program easily,Synchronization check,Through a live-point camera, you'll be able to do a physical post-check of the chip(Selected)Through this device,Quality of simultaneous confirmation in production.
| Main specification | |
|---|
| Brand | Panasonic |
| Model | MDP300 |
| Type 1 | SMT Equipment |
| Type 2 | Soldering Equipment |
| Type 3 | |
| Size | W 1 380 * D 1 640 * H 1 430 |
| Weight | 2300KG |
| Voltage | San AC 200 V ±10 V,50/60 Hz |
| Rated power | |
| Gas source | 0.49±0.05Mpa |
| Operating System | |
| Other | |
| Parameters | |
|---|
| Productivity | 0.65 s/IC |
| Load Precision | XY(3σ): ±5 μm |
| Base size(mm) | L 50 * W 50 ~ L 330 * W 330 |
| Crystal Size(mm) | L 1 * W 1 ~ L 25 * W 25 |
| Crystal varieties | Most12Types |
| Crystal supply | Halo12Type |
| Full load | VCMHeader Specification : 1 N ~ 50 N |
| Workhead heating | When supersonic specification:Maximum Settings 300 ℃ |
| Power | San AC 200 V ±10 V,50/60 Hz,Max4 kVA |
| Air pressure source | 0.4 MpaAbove,50 L /min |
| Device Dimensions(mm) | W 1 380 * D 1 640 * H 1 430 |
| Weight | 2 300 kg |
